| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_aafe0172ffd94d3486c518b0709bb2b3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-16 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L101-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K9-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00 |
| filingDate |
2006-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2008-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_65255759f7ddfc3d004832bd8a12b131
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6e7300e7490734f83b5d64d7cb67b81b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_77d5532d8c4f72f1b12b81dd6064715b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e1ea374b8d3684285466ecbdd23d2fab
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_00f1d96c48daaac4b37e2b08d9692628
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_956848839b24bbf531e56eb3e2068a07 |
| publicationDate |
2008-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-100815384-B1 |
| titleOfInvention |
Composition for Anisotropic Conductive Film |
| abstract |
The present invention relates to a composition for anisotropic conductive films containing polymer particles having a size equal to or smaller than the conductive particles and fused at a thermocompression temperature. When the film is manufactured using the composition, the flowability is suppressed during thermocompression. By controlling this, it is possible to provide an anisotropic conductive film showing excellent reliability by maintaining low electrical connection resistance even in harsh conditions after high temperature, high humidity and thermal shock. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100920613-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101202045-B1 |
| priorityDate |
2006-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |