Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c16d2144a81bfa32a665dca1e93c3d37 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30625 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31053 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1436 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D1-72 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1472 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
filingDate |
2006-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2008-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a771a107b7770115a8c459f42a790af8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_117ab14377f707a1232d7a1c8751281e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fa236db1c192e9dc8dbd333040cab24f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3d3ae0841af6c16643ea3e0a5e5f72e9 |
publicationDate |
2008-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-100814416-B1 |
titleOfInvention |
High Flattening Slurry Composition and Chemical Mechanical Polishing Method Using the Same |
abstract |
In the high planarization slurry composition and the chemical mechanical polishing method using the slurry composition, the slurry composition comprises 0.1 to 10% by weight of the abrasive, 0.1 to 3.0% by weight of the ionic surfactant, 0.01 to 0.1% by weight of the nonionic surfactant and the carboxyl group as the polishing accelerator. It has a composition containing 0.01 to 1.0% by weight of the amino compound having and excess water containing a basic pH adjuster. The slurry composition may include a nonionic surfactant and a polishing accelerator to quickly polish the top of the silicon oxide film having a high level, and to have self-stopping properties at the bottom of the silicon oxide film. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101470979-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101132399-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101674083-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101483451-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10464184-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160015908-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101349771-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101472858-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101396251-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015171468-A1 |
priorityDate |
2006-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |