http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100814267-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S977-777 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S977-888 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S977-883 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B21-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24D11-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7684 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-245 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-04 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D11-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D13-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-321 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B21-00 |
| filingDate | 2000-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2008-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2008-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100814267-B1 |
| titleOfInvention | Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal synthetic abrasives |
| abstract | The present invention is directed to a method and apparatus for planarizing microelectronic substrate 112. In one embodiment, the apparatus 100 may include a fixed abrasive polishing pad 141 having metal polishing elements 115 to be a composite of metal located on the microelectronic substrate. Optionally, the metal polishing elements 151 may comprise a refractory metal, wherein the substrate comprises a refractory metal, the substrate comprising two metals 115, 116, and the polishing elements comprise a second And may have a planarization rate of the first metal that is about two times or less the rate of planarization of the metal. A single fixed abrasive polishing pad 141 and a single polishing fluid can be used to planarize both metals.n n n n Microelectronic Substrates, Flattening, Metal Polishing Elements, Fixed Abrasive Polishing Pads, Refractory Metals, Polishing Fluids |
| priorityDate | 1999-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 49.