http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100813418-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32257 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32245 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-64 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-62 |
| filingDate | 2006-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2008-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2008-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100813418-B1 |
| titleOfInvention | High Reliability LED Lamps and LED Assemblies |
| abstract | The present invention relates to an LED lamp and an LED lamp assembly having improved heat dissipation, comprising: a LED chip including a substrate, a P-type electrode and an N-type electrode formed on both sides of the substrate; A cup-type anode lead having a recess on the top surface of which a P-type electrode of the LED chip is bonded; A cathode lead wire-bonded with the N-type electrode and spaced apart from the cup-shaped anode lead; And it provides an LED lamp comprising a packaging material for sealing the LED chip, the cup-shaped positive lead and the negative lead.n n n According to the present invention, if the lead on which the chip is placed is used as the anode, the common end can be used to treat a wide pattern for heat dissipation, and the blinking frequency of a specific LED in the process of several LEDs treating each blinking. High heat dissipation in a situation where the heat is distributed through a common pattern, so that each lamp has a certain deterioration characteristics, it is possible to avoid the non-uniformity of the entire display device due to degradation of the LED under a specific harsh conditions.n n n n LED, heat dissipation, anode lead, substrate. |
| priorityDate | 2006-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 21.