| abstract |
The present invention relates to an epoxy resin composition for sealing a semiconductor device, which is a triazine resin comprising a thiolso cresol novolac epoxy resin, a diglycidyl ether bisphenol-modified epoxy resin, two or more coupling agents, and at least one mercapto group. Including the adhesion increasing agent, it improves the problem of cracks on the pad surface and the chip during the high temperature solder process generated during thermal shock, especially Pb free in the post-semiconductor process, and the epoxy encapsulant and the cupper lead frame Rather, the present invention relates to an epoxy resin composition for sealing semiconductor elements that maintains high reliability by reducing peeling occurring in surface adhesion of nickel, age, and palladium. |