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filingDate 2006-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2008-01-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_79b92c48a624d13203e509fa103844ac
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publicationDate 2008-01-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-100791477-B1
titleOfInvention Phase change memory unit, manufacturing method thereof, phase change memory device including same and manufacturing method thereof
abstract A phase change memory unit, a manufacturing method thereof, a phase change memory device including the same, and a manufacturing method thereof are disclosed. A first electrode is formed on the substrate, and an insulating structure having an opening exposing the first electrode is formed on the first electrode. After the nucleation layer pattern is formed on the sidewalls of the first electrode and the opening, a phase change material layer pattern is formed on the nucleation layer pattern while filling the opening. A second electrode is formed on the phase change material layer pattern. A chalcogenide compound such as GST is deposited on a nucleation layer composed of a metal oxide having high electrical insulation by chemical vapor deposition to form a three-dimensional phase change material layer filling the opening. Therefore, a separate breakdown is not required to cause phase transition in the phase change material layer pattern, and it is possible to prevent the reset current from being pushed during the phase change of the phase change material layer pattern. In addition, it is possible to prevent the occurrence of an electrical short between the electrodes, it is possible to completely fill the opening while the phase change material layer has a uniform grain size.
priorityDate 2006-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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