http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100776959-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01012 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0102 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73203 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01077 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-188 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-563 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2001-08-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2007-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2007-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100776959-B1 |
| titleOfInvention | Resin composition for semiconductor encapsulation, and semiconductor device, semiconductor wafer, and mounting structure of semiconductor device using same |
| abstract | (Problem) A resin composition for semiconductor encapsulation, which exhibits low viscosity at a relatively low temperature of 80 ° C. or lower as an epoxy resin sealing material, and is particularly excellent in discharging and coating workability and excellent in storage stability, Provided are a semiconductor device, a semiconductor wafer, and a mounted structure of the semiconductor device.n n n (Solution) A resin composition for semiconductor encapsulation comprising (A) an epoxy resin, (B) a phenol resin, and (C) a latent curing accelerator, having a solid form at 25 ° C. or a viscosity of at least 400 Pa · s, and at 80 ° C. It has a viscosity of 200 Pa · s or less. It is preferable to use a microcapsule type curing accelerator as the latent curing accelerator. The semiconductor device is obtained by mounting and sealing a semiconductor element on a wiring circuit board using this resin composition for semiconductor sealing. Only the gap between the circuit board and the semiconductor device may be sealed or may be sealed to contain the semiconductor device. Even when the semiconductor device is mounted on an external substrate for mounting, the sealing resin composition can be interposed. Moreover, the resin layer for sealing which consists of said composition can also be formed in the electrode part arrangement | positioning surface on a semiconductor wafer. |
| priorityDate | 2000-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 187.