abstract |
An object of the present invention is to provide a multilayer printed wiring board having excellent fracture toughness, dielectric constant, adhesiveness, workability, and the like. The present invention provides a printed wiring in which an insulating resin layer is formed on a substrate and a conductor circuit is formed on the insulating resin layer. In a board | substrate, the said insulated resin layer is a printed wiring board characterized by consisting of polyolefin resin. |