| abstract |
The present invention provides a metal powder-containing flux that is interposed between a bump and a circuit electrode when mounting an electronic component by solder bonding. The metal powder has a core metal formed of metals such as tin and zinc, and a surface metal including gold, silver, and the like covering the surface of the core metal. As a result, it is possible to ensure both solder bonding properties and securing insulation properties without remaining as a residue in a state where metal powder tends to migrate after reflow. |