http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100773617-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7684 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76879 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-001 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-321 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 |
| filingDate | 2000-10-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2007-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2007-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100773617-B1 |
| titleOfInvention | Integrated circuit manufacturing method |
| abstract | The systems and methods according to the present invention facilitate effective material deposition and wafer planarization during IC wafer fabrication. In particular, the present invention is useful for facilitating effective copper deposition and fabrication of interconnects between IC components. The deposition polishing system 200 and method of the present invention simultaneously perform copper deposition and polishing. One embodiment of the deposition polishing system 200 and method of the present invention includes a wafer holder 220, a polishing pad component 230, and a CMP plating bath 235. The CMP plating bath 235 is a container for holding a solution 238 used in a plating process (eg, electroplating, electroless plating, etc.) for depositing a metallic material (eg, copper) on the wafer 224. The wafer 224 is located in a plating bath containing the plating solution 238, and the polishing pad component 230 is over a portion of the wafer surface (eg, interconnect trench) while the metallic material is deposited on the wafer 224. Prevents material from being deposited. In addition, the polishing pad component facilitates moving the plating solution 238 to the wafer and the operation of the polishing pad component 230 agitates the plating solution 238. |
| priorityDate | 1999-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 34.