| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-423 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76879
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67051
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6708
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6723
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6715
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6719
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-001 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16 |
| filingDate |
2000-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2007-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2007-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-100773164-B1 |
| titleOfInvention |
Plating apparatus and plating method of substrate, electrolytic treatment method and apparatus |
| abstract |
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for plating a substrate for use in filling a metal, such as copper (Cu), with a microwiring pattern (concave) formed on a semiconductor substrate. A substrate holding portion 36 which is held and rotated so as to abut the peripheral edge portion of the plated surface of the substrate held by the substrate holding portion 36 and sealingly sealing the peripheral edge portion thereof. And a cathode electrode 88 which is in contact with the substrate for conducting electricity, and which is freely disposed on the cathode holding portion 38, which rotates integrally with the substrate holding portion 36, and above the cathode portion 38. The electrode arm portion 30 having the anode 98 downward, and the anode 98 of the electrode arm portion 30 adjacent to the plated surface of the substrate held by the substrate holding portion 36 and the plated surface thereof. Has a plating liquid injection means for injecting the plating liquid into the space between the layers. Thereby, the plating process and the process accompanying it can be performed in a single unit. |
| priorityDate |
1999-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |