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filingDate 2004-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2007-10-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2007-10-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-100766205-B1
titleOfInvention Covering electroconductive particle, anisotropic conductive material, and conductive connection structure
abstract INDUSTRIAL APPLICABILITY The present invention provides coated conductive particles, anisotropic conductive materials using the coated conductive particles, and conductively connected conductive coatings using the coated conductive particles or anisotropic conductive materials, which can be suitably used for electrically connecting electronic devices or electronic components with high connection reliability. Provides a connection structure. It is coated electroconductive particle containing the particle | grains which have the surface containing the conductive metal, and the insulating fine particle which coat | covers the surface of the particle | grains which have the surface containing the said conductive metal, The particle | grains which have the surface containing the said conductive metal are plural in the surface. It is characterized by the coated electroconductive particle which has the processus | protrusion of.n n n n Covering electroconductive particle, anisotropic conductive material, electrically conductive connection structure, insulating particle
priorityDate 2003-07-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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