http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100763692-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15312 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0195 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01046 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0102 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01019 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-096 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09563 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15174 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4661 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4602 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-429 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4614 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49811 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49833 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4617 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-115 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 2000-11-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2007-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2007-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100763692-B1 |
| titleOfInvention | Multilayer Circuit Boards and Semiconductor Devices |
| abstract | Several sheets of a circuit board having conductor circuits on one side or both sides of the insulating hard substrate and having via holes filled with conductive material in the openings penetrating through the insulating hard substrate to the conductor circuit are laminated with the adhesive layer interposed therebetween. And a multi-layer circuit board formed by collectively hot pressing. Of the plurality of stacked circuit boards, a conductive bump is formed on the surface of one of the outermost circuit boards located directly on the outermost side thereof, and a conductive bump is formed on the surface of the other circuit board located on the outermost side of the plurality of circuit boards. It is located above and the conductive pins or balls are disposed. Such a multilayer circuit board is used as a package board, and electronic components such as LSI chips are mounted thereon to constitute a semiconductor device. The multi-layered circuit board is used as a core board, and a build-up wiring layer is formed on both surfaces or one side thereof, and solder bumps are provided on the surface of the outermost conductor circuit of the build-up wiring layer and the other side of the build-up wiring layer. Conductive pins or balls are disposed on the surface of the outermost conductor layer constituting the multi-layered circuit board, which is advantageous for high-density wiring and high-density installation of electronic components.n n n n Insulating hard substrate, via hole, multilayer circuit board |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101065505-B1 |
| priorityDate | 1999-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 84.