http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100763429-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0226 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0758 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0233 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-039 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0045 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-039 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02B5-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F220-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-28 |
| filingDate | 2001-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2007-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2007-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100763429-B1 |
| titleOfInvention | Positive photosensitive thermosetting resin composition, transfer material and image forming method |
| abstract | Since the present invention is excellent in storage stability, it is easy to use, can be developed in a weak alkaline aqueous solution having a pH of about 10, has a high resolution, and has excellent film transparency after curing, and is excellent in heat resistance, solvent resistance, and insulation. This excellent positive photosensitive thermosetting resin composition is provided.n n n Moreover, this invention is alkali-soluble obtained by copolymerization containing 5 mol%-80 mol% of the polymerizable monomer of the following general formula (I) and monomer containing 5 mol%-80 mol% of carboxylic acid group as an essential component. It consists of a positive photosensitive thermosetting resin composition containing 10-120 weight part of 1, 2- quinonediazide compounds with respect to resin and 100 weight part of said alkali-soluble resins.n n n n n n n n (Wherein R 1 represents a hydrogen atom or a methyl group. X is a halogen atom, a hydroxy group, or C 1-12, and may have a substituent, an alkoxy group, an aryloxy group, an alkylcarbonyloxy group, Arylcarbonyloxy group, alkoxycarbonyloxy group, aryloxycarbonyloxy group, alkylsulfonyloxy group or arylsulfonyloxy group) |
| priorityDate | 2000-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 336.