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filingDate 2005-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2007-10-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2a2bc23cd9a39b88bdff51673d7cccc5
publicationDate 2007-10-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-100757108-B1
titleOfInvention Hard mask polymer for forming fine pattern of semiconductor device and composition for hard mask containing same
abstract BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hard mask polymer and a composition containing the same for forming a fine pattern of a next-generation semiconductor device, and using a polyamic acid composition having high heat resistance in forming an etched layer pattern of a semiconductor device. By forming a polyamic acid film by a spin coating method and an additional thermal process, the polyamic acid film is used as a hard mask to help easily etch a fine pattern into an underlying layer.
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