http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100755774-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02074 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D11-0047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D3-221 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23G1-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3213 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23G1-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-321 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D7-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D11-00 |
| filingDate | 2003-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2007-09-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2007-09-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100755774-B1 |
| titleOfInvention | Cleaning liquid for semiconductor substrates and manufacturing method of semiconductor device |
| abstract | An object of the present invention is to remove the abrasive particles of silica and alumina and the like and the polishing waste of copper while suppressing the corrosion of copper, and also derived from additives used for preventing corrosion of copper on the surface of the copper wiring after cleaning. A cleaning liquid for semiconductor substrates having little organic residue remaining thereon, and a method for manufacturing a semiconductor device using the cleaning liquid. The said object is achieved by the cleaning liquid for semiconductor substrates with a copper wiring which contains a basic compound and 1 or more types chosen from the group which consists of a sugar alcohol and a saccharide. Moreover, this invention manufactures a semiconductor device including the process of forming a copper wiring by chemical mechanical polishing, and wash | cleaning with the cleaning liquid for semiconductor substrates containing 1 or more types chosen from the group which consists of a sugar alcohol and a saccharide, and a basic compound. Provide a method.n n n n Cleaning liquid for semiconductor substrates, semiconductor device, copper wiring |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10121649-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101146000-B1 |
| priorityDate | 2002-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 98.