http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100755116-B1

Outgoing Links

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3a17dc10b5bd6e5f0df2ce1aab3bbdce
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0217
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-345
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02274
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-314
filingDate 2006-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2007-09-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b4e87ad17d9509e48d7845bb239b13e8
publicationDate 2007-09-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-100755116-B1
titleOfInvention Method of forming silicon nitride film
abstract The present invention relates to a method for forming a silicon nitride film in a PECVD batch type chamber. That is, in the present invention, in the PECVD silicon nitride film forming method, in order to solve the conventional problem that the thickness of the oxide film is reduced after the RF plasma cleaning process in the PECVD silicon nitride film deposition process on the wafer in the PECVD device, By increasing the number of wafers, the deposition time is compensated so that the deposition time of the silicon nitride film on the wafer is set to be gradually longer, so that the thickness of the silicon nitride film on the wafer is uniformly deposited regardless of the RF plasma cleaning cycle, thereby improving semiconductor yield. Will be.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160064288-A
priorityDate 2006-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005139578-A1
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http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID3084099

Total number of triples: 26.