http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100752504-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-405 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1669 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-168 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16 |
| filingDate | 2004-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2007-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2007-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100752504-B1 |
| titleOfInvention | Method for forming metal wiring in pattern using electroless plating |
| abstract | The present invention relates to a method for forming a metal wiring in a pattern using an electroless plating, and to form a thin and uniform seed layer in a copper electroless plating solution using cobalt or formaldehyde as a reducing agent when forming the primary seed layer. And a pattern by bottom-up filling method using dimerethane octasulfonic acid (4,5-dithiaoctane-1,8-disulfonic acid) or mercaptopropanesulfonate (3-mercapto-1-propanesulfonate) as an additive. It comprises a step of filling with a metal, the method of forming a metal wiring in the pattern using the electroless plating according to the present invention to reduce the surface roughness of the metal wiring and improve the film quality, such as voids (seam) There is an effect that can form a bump (bump) by filling the bottom-up filling method without a defect.n n n n Electroless Plating, 4,5-dithiaoctane-1,8-disulfonic acid, 3-mercapto-1-propanesulfonate, SPS, MPSA, void, 씸 ( seam, bottom-up filling, bump |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9365943-B2 |
| priorityDate | 2004-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 53.