http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100750742-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-165 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23D45-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23D47-005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H9-1057 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-02 |
| filingDate | 2005-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2007-08-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2007-08-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100750742-B1 |
| titleOfInvention | RF system and its manufacturing method |
| abstract | An RF system is disclosed that is easy to manufacture and advantageous for integration and miniaturization. The RF system according to the present invention comprises: a silicon substrate having at least one via hole filled with a conductive material so that both surfaces are electrically energized; At least one planar element formed on one surface of the silicon substrate; And at least one RF MEMS device formed on the other surface of the silicon substrate.n n n n RF, system, miniaturization, integration, silicon-based |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101012175-B1 |
| priorityDate | 2005-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 20.