http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100749992-B1
Outgoing Links
Predicate | Object |
---|---|
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-244 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-244 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-44 |
classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16 |
filingDate | 2004-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2007-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2007-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | KR-100749992-B1 |
titleOfInvention | Electroless Gold Plating Amount |
abstract | It is an object of the present invention to provide an electroless gold plating solution that can obtain a gold plated film without a formula on its surface and that can secure sufficient soldering strength when soldering.n n n An electroless gold plating solution containing a water-soluble compound of gold, and containing a hydroxyalkylsulfonic acid or a salt thereof represented by the following general formula as a reducing agent, and an amine compound.n n n n n n n n (Wherein R represents any one of a phenyl group, a naphthyl group, a saturated or unsaturated alkyl group, an acetyl group, an acetonyl group, a pyridyl group and a furyl group which may have a hydrogen, a carboxy group or a substituent, and X represents hydrogen, Na, K) And NH 4 , and n is an integer of 0 to 4). |
priorityDate | 2003-06-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 92.