| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B12-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B12-315 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-0207
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5226
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76802
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B12-09 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-108
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-8242
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate |
1998-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2007-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2007-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-100748821-B1 |
| titleOfInvention |
Semiconductor integrated circuit device and process for manufacturing the same |
| abstract |
In the peripheral circuit area of the DRAM, a connection hole for electrically connecting the first layer wiring 14 and the second layer wiring 26 is divided into two holes into connecting holes 17a and 17b, and the respective holes are drilled. After the connection holes 17a and 17b are formed, plugs 18a and 25a are formed in the connection holes 17a and 17b, respectively. |
| priorityDate |
1997-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |