http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100747132-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 |
| filingDate | 2001-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2007-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2007-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100747132-B1 |
| titleOfInvention | Plating system with remote second anode for semiconductor manufacturing |
| abstract | The present invention provides an electroplating system 50 for a semiconductor wafer 66 that includes a plating chamber 52 connected to a plating solution bath 60 by circulation systems 52, 56, 58. The semiconductor wafer 66 is used as a cathode and an inactive first anode 64 is disposed in the plating chamber 52. The consumable remote second anode 75 in the plating solution bath 60 provides metal ions for plating.n n n n Electroplating, Anodes, Cathodes, Copper Ions, Circulation Systems, Semiconductor Wafers, Chambers |
| priorityDate | 2000-10-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 20.