http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100743844-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B22F9-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B22F9-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G4-0085 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-008 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F9-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F9-16 |
| filingDate | 2000-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2007-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2007-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100743844-B1 |
| titleOfInvention | Copper Powder And Manufacturing Method Of Copper Powder |
| abstract | When forming the external electrode of a multilayer ceramic capacitor by sintering of copper powder, this invention obtains the copper powder which can obtain the integral baking goods without an air gap even if the sintering temperature is low.n n n Narrow particle size distribution range in which the average particle diameter is in the range of 0.1 micrometer or more and less than 1.5 micrometers, and A value according to following formula (1) shows 1.2 or less between X25, X50, and X75 value defined below Copper powder, which is a molten sintered plastic product when it maintains at 800 degreeC temperature in 1 atmosphere of inert gas atmospheres.n n n A value = (X75-X25) / X50 (1)n n n However, X25, X50, and X75 are cumulative particles having a particle diameter X (µm) on the horizontal axis and a Q% (the proportion of particles having a particle diameter equal to or less than X corresponding to X; the unit is volume% of the particle) on the vertical axis. In the figure curves, the values of the respective particle diameters (X) correspond to Q% = 25%, 50% and 75%. The copper powder can be obtained by performing in the presence of ammonia or an ammonium group when wet reduction from cuprous oxide to metal copper powder.n n n n Copper powder, wet reduction, sintering, voids, fused plastic products |
| priorityDate | 1999-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 41.