http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100740594-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F24C7-105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 2006-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2007-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2007-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100740594-B1 |
| titleOfInvention | Bump forming device |
| abstract | In the bump forming apparatus, productivity is improved without increasing the kind of the holding part of the holding tool which moves the chip. The bump forming apparatus 10 includes a tray loader portion 12, a supply and receiving tray 14, and also a bump forming portion 20 having two bonding stages 24 and 26 for forming bumps, bumps A leveler portion 40 comprising a leveler stage 44 having two holding stages for uniformly adjusting height, and two bonding stages of the supply and accommodation tray 14-bump forming portion 20 to hold a chip ( And a chip collet conveyance section 60 for holding and moving between the two holding stage-feeding and receiving trays 14 of the leveler section 40.n n n n Bump, Chip, Collet, Leveler, Stage, Tray, Bonding, Carrying, Gripping, Pick & Place, Cycle Time, Semiconductor |
| priorityDate | 2005-03-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419499693 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID3033151 |
Total number of triples: 15.