| abstract |
In the semiconductor device of the chip size package, since the semiconductor substrate 60 is a structure separated by the slit holes 80, it is necessary to be supported and fixed on the same plane by the resin layer 78, but adheres to the insulating film 74 and is uniform. Because of the thickness, there was a practical problem in that sufficient strength could not be obtained yet. In order to solve the above problems, the semiconductor device of the present invention includes a semiconductor substrate having a first region 12 and a second region 13, 14, a first region 12, and a second region 13, 14. Is formed on the surface of the first region 12 and the second region 13, 14 of the semiconductor substrate 10 adjacent to the dicing groove 30. To integrally support the semiconductor substrate 10 on the surface of the first region 12 and the second region 13, 14 of the semiconductor substrate, including the stepped portion 31 and the stepped portion 31 exposing the stepped portion 31. By providing the ground layer 34, the adhesiveness of the step part 31 and the resin layer 34 is improved.n n n n Semiconductor substrate, electrode for external connection, dicing groove, connection means, step, resin layer |