http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100727325-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31133 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0274 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-2002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-324 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30604 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-312 |
| filingDate | 2005-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2007-06-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2007-06-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100727325-B1 |
| titleOfInvention | Substrate processing method and chemical liquid used in this method |
| abstract | Provided is a substrate processing method capable of suppressing damage to an organic film pattern or a substrate.n n n The substrate processing method which concerns on this invention is equipped with the organic film pattern processing process which processes the organic film pattern formed on the board | substrate. In the organic film pattern processing process, a heat treatment for heating the substrate (step S00), a removal process for removing the deteriorated layer or the deposited layer formed on the surface of the organic film pattern, and a dissolution deformation process for dissolving and deforming the organic film pattern (step S3) is performed in this order. At least a part of the removal process is performed by chemical liquid treatment (step S1) on the organic film pattern.n n n n Substrate Processing Method |
| priorityDate | 2004-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 74.