http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100720095-B1

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filingDate 2000-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2007-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2007-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-100720095-B1
titleOfInvention Thin film transistor array substrate and manufacturing method thereof
abstract First, an auxiliary layer for a pad is formed on a pad portion on which a gate line, a gate electrode, and a gate pad in a horizontal direction including a gate line, a gate electrode, and a gate pad are formed on the substrate by stacking and patterning an aluminum-based conductive material. , A semiconductor layer and an ohmic contact layer are sequentially formed. Subsequently, a metal line such as chromium is laminated and patterned to form a data line including a data line crossing the gate line, a source electrode, a drain electrode, and a data pad having contact holes on the pad auxiliary layer. The protective film is then stacked and patterned to form contact holes exposing the drain electrode, gate pad, and data pad. At this time, the pad auxiliary layer is exposed through the contact hole of the data pad. Subsequently, the IZO is stacked and patterned to form a pixel electrode, an auxiliary gate pad, and an auxiliary data pad electrically connected to the drain electrode, the gate pad, and the data pad and an auxiliary layer for the pad below. As such, by forming an auxiliary layer for pads based on aluminum, the contact resistance of the pad part may be minimized during the liquid crystal panel inspection.
priorityDate 2000-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 30.