http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100715362-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A01K7-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A01K5-0233 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K5-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373 |
| filingDate | 2005-03-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2007-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2007-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100715362-B1 |
| titleOfInvention | Resin composition for heat dissipating material and heat dissipating material |
| abstract | The present invention is to provide a heat dissipation material having excellent adhesiveness, flexibility, thermal conductivity, and durability obtained by curing the resin composition for heat dissipation material having excellent curability and the resin composition for heat dissipation material. The resin composition is a resin composition for a heat dissipating material comprising a (meth) acrylic polymer (A) and a thermally conductive filler (B), wherein the (meth) acrylic polymer (A) has a hydrolyzable silyl group and a glass transition temperature of 10 It is characterized by being less than ℃. |
| priorityDate | 2004-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 96.