| abstract |
Resin composition, substrate material, sheet, laminate, resin-bonded copper foil, copper clad laminate, TAB tape, printed board, prepreg and adhesive, which are excellent in mechanical properties, dimensional stability, heat resistance, flame retardancy, etc., and particularly excellent in high temperature properties. Provide a sheet.n n n A resin composition for electronic materials containing 100 parts by weight of a thermosetting resin and 0.1 to 65 parts by weight of an inorganic compound, wherein the average linear expansion ratio is from 10 ° C higher than the glass transition temperature of the resin composition to 50 ° C higher than the glass transition temperature of the resin composition. The resin composition whose ((alpha) 2) is 17x10 < -5> [degreeC- 1 ] or less.n n n Thermosetting resins, inorganic compounds, glass transition temperatures, multilayer printed boards, insulated boards |