| abstract |
The present invention is an epoxy resin molding material for sealing a semiconductor package containing (A) an epoxy resin, a (B) curing agent, and (C) an inorganic filler as an essential component, wherein the average particle diameter of the inorganic filler (C) described above is 12 µm or less. It is related with the resin composition for semiconductor sealing whose specific surface area is 3.0 m <2> / g or more.n n n n Resin for semiconductor sealing, epoxy resin, curing agent, inorganic filler, resin molding material |