| abstract |
A support substrate having an electrical insulating layer, a metal layer disposed on an upper surface of the insulating layer and having a printed conductor formed by structuring, and a metal cooling body provided on the lower surface of the insulating layer; In order to improve thermal conduction and reduce parasitic inductance in an electronic semiconductor module including at least one semiconductor element disposed on the support substrate, the electrically insulating layer has at least one recess and faces away from the support substrate. At least one connection surface provided on the upper surface of the semiconductor element facing away from the substrate is electrically connected to the contact element directly contacting the metal cooling body through the recess.n n n n Electrical insulation layers, metal layers, support substrates, metal cooling bodies, recesses, contact elements |