| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01P2004-64
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01P2004-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31053
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3105 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 |
| filingDate |
2001-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2007-02-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2007-02-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-100679198-B1 |
| titleOfInvention |
Methods for Making Abrasives and Flat Layers |
| abstract |
The slurry containing SiO 2 is used as an abrasive in the planarization of the silicon dioxide layer. Slurries containing silica sol having a grain size distribution have been found to achieve higher polishing rates in the polishing process of SiO 2 layers.n n n Silica, abrasive, grain size distribution, polishing rate, selectivity |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8877643-B2 |
| priorityDate |
2000-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |