| abstract |
In an epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler, the filler is a porous silica having a specific surface area of 6 to 200 m 2 / g, a specific ratio of 2.0 to 2.2, and an average particle diameter of 2 to 50 μm. The epoxy resin composition is easy to mold, has low invasiveness and reliability in the cured state, and is suitable for forming a preformed hollow semiconductor package.n n n n Epoxy Resin, Inorganic Filler, Porous Silica, Invasive, Semiconductor Packages |