http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100676562-B1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_292633037460f2a7c683a19ca8d33ddd |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L9-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 |
| filingDate | 2006-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2007-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aa1567d13a4c098bb857b7dcbc394e9e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f3ab9deca3bd07fda0c5f00ca59300b9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8d1818796c289efa3b7cae6647db32de http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9e171c7bd45cc51a43dc33c97caf6326 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a824ae66c632253bd86c46d80639b077 |
| publicationDate | 2007-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100676562-B1 |
| titleOfInvention | Dicing die adhesive film composition |
| abstract | The present invention relates to a composition for producing a dicing die adhesive film. Dicing die adhesive film composition according to the present invention, the molecular weight of 50,000 or more rubber (Rubber) 15 to 28% by weight; 10 to 20% by weight of modified rubber ends; 10 to 30% by weight crystalline epoxy material; And 22 to 65% by weight of a general purpose epoxy material. According to the present invention, in the dicing die adhesive film that bonds the silicon chip and the PCB used in the dicing process during the semiconductor manufacturing process, it is possible to minimize the generation of voids to improve wiring fillability, moisture resistance evaluation (MRT evaluation ) Has a good advantage that the reliability of the product can be sufficiently secured, it is possible to ensure the reliability of the semiconductor packaging process. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100899720-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100994963-B1 |
| priorityDate | 2006-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 30.