http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100673626-B1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_aafe0172ffd94d3486c518b0709bb2b3 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2201-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2666-72 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-544 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-17 |
| filingDate | 2005-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2007-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_003f884877103a5656a7911a6619e490 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_37a89b2d44b6efcb9f2c5ebf422a195f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b563269330a6f59ae454fcf90b0123ad |
| publicationDate | 2007-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100673626-B1 |
| titleOfInvention | Epoxy Resin Compositions for Semiconductor Device Sealing |
| abstract | The present invention relates to an epoxy resin composition for sealing semiconductor devices, and more particularly, to an adhesion force with a copper lead frame, a nickel lead copper lead frame, and a copper lead frame coated with silver and / or gold after nickel / palladium plating. The present invention relates to an epoxy resin composition for sealing a semiconductor device comprising a silane coupling agent containing an ethylenediamine group in a chemical structure in order to improve the efficiency.n n n The epoxy resin composition of the present invention can improve the adhesion of not only the copper lead frame but also nickel plated copper lead frame, or nickel and palladium plated silver and / or gold plated copper lead frame, thereby increasing the reliability of the semiconductor package. It is useful for manufacturing a resin-sealed semiconductor device. |
| priorityDate | 2005-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 55.