| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-043
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-087 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-206
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-008
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3489 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-008 |
| filingDate |
2003-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2007-01-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2007-01-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-100669061-B1 |
| titleOfInvention |
Reflow Soldering Method |
| abstract |
The soldering method includes exposing a solder paste comprising solder powder and flux on a member to a free gas, and heating the solder paste to reflow the solder paste to evaporate the working elements of the solder paste. Since the flux residue is a residue without action elements, it is not necessary to carry out cleaning after soldering to remove the flux residue. |
| priorityDate |
2002-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |