http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100668948-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0759 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-036 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31681 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-068 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0346 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 |
| filingDate | 2005-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2007-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2007-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100668948-B1 |
| titleOfInvention | Metal Laminate and Method of Manufacturing the Same |
| abstract | According to the present invention, the thermal expansion coefficient laminated on the low thermally expandable polyimide resin layer with two low thermally expandable polyimide resin layers having a thermal expansion coefficient of 20 ppm / ° C. or less and a metal conductor layer and optional components exceeds 20 ppm / ° C. It is to provide a metal laminate for a printed circuit board comprising a high thermally expandable polyimide resin layer and a method of manufacturing the same.n n n Coefficient of thermal expansion, low thermal expansion polyimide, high thermal expansion polyimide, metal laminates, polyimide films, printed circuit board materials |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101096967-B1 |
| priorityDate | 2004-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 54.