http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100666743-B1

Outgoing Links

Predicate Object
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-011
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L81-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-128
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H02N11-006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-0013
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-375
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L81-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C45-00
filingDate 2004-08-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2007-01-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2007-01-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-100666743-B1
titleOfInvention Molding resin composition, conductive member and electrostatic actuator
abstract The present invention is excellent in the transferability to a fine shape and moldability (dimension precision), contributes to the improvement of productivity, the surface resistance value of the molded product can be lowered, and the molding resin composition for stable conductivity can be obtained, and this molding A conductive member formed by injection molding using a resin composition for use, and an electrostatic actuator as the conductive member are provided.n n n Into the molding resin composition (1) having a low molecular weight polyphenylene sulfide (PPS) (2) as an essential composition, carbon black having a fine particle shape was selected based on the total weight of the molding resin composition (1). To 15% by weight and 45 to 50% by weight of the fine particle glass beads 3 are added.
priorityDate 2003-08-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559581
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID297

Total number of triples: 25.