http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100664870-B1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3a17dc10b5bd6e5f0df2ce1aab3bbdce |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28 |
| filingDate | 2005-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2007-01-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0090597aa1167861e72ae75485b9308c |
| publicationDate | 2007-01-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100664870-B1 |
| titleOfInvention | Low resistance copper wiring and forming method |
| abstract | A low resistance copper wiring using a seam and a method of forming the same are disclosed. In the method of forming a low resistance copper wiring according to the present invention, an insulating film is formed on a substrate, and the insulating film is selectively etched to form wiring grooves. A copper layer filling the wiring groove is formed on the entire surface of the substrate under the condition that the seam is generated by the electroplating method, and then the copper layer is polished to form the wiring with the seam formed on the upper center of the copper wiring. Since the surface area is increased by intentionally forming a core inside the copper wiring to include a vacancy portion formed by the core, the resistance is reduced due to the increase in the surface area of the copper wiring in which most electrons actually move. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8319348-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100854863-B1 |
| priorityDate | 2005-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341 |
Total number of triples: 18.