| abstract |
The present invention relates to an insulating resin composition having an interpenetrating crosslinking structure and a method of manufacturing the same, and more particularly, a photocurable epoxy (meth) acrylate oligomer resin composition, a thermosetting epoxy resin composition, and a reactive diluent are contained in a certain component ratio. After the complete curing of the mixed composition with light, the resin composition forms an interpenetrating crosslinked structure in a sequential process of performing heat curing, and together with conventional productivity, electrical properties, mechanical strength, thermal properties and Reliability is improved, and in particular, it is excellent in workability, lead wire adhesion, insulation breakdown, fire characteristics, cost reduction, etc. It is about. |