| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_64720ec60fb0ab5efb3ed0d65e6f36b8 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y10-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y30-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y40-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02658
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02488
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02502
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02557
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1275
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02551
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02568
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0256
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02499
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1204 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-20 |
| filingDate |
2005-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2006-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d2fc311dd16bc466ed7e93bdf4f02d62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c50af8094c205acd16ca209e6757655d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8b9777dee3bcef504907e86305add41d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7e9a3a284844839b74c17e91bfb89984
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a3d04650458173e9ff5638434dcdace |
| publicationDate |
2006-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-100661695-B1 |
| titleOfInvention |
Semiconductor thin film using self-assembled monolayer and its manufacturing method |
| abstract |
The present invention relates to a semiconductor thin film using a self-assembled monolayer (SAM) and a method for manufacturing the same. According to the present invention, an insulating layer is formed by forming a uniform inorganic seed layer using a self-assembled monolayer (SAM). By increasing the adhesion between the semiconductor layer and the surface tension is reduced, it is possible to manufacture a high-performance semiconductor thin film free of defects. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100991693-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101457157-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101247469-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160055334-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8656582-B2 |
| priorityDate |
2005-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |