| abstract |
In the cleaning liquid composition capable of removing the polymer without damaging the conductive structure and suppressing particle contamination and metal contamination, a method for preparing the same, a cleaning method using the same, and a method for manufacturing a semiconductor device, the cleaning liquid composition includes alkylammonium hydroxide, fluorine compound, and Organic ammonium fluoride aqueous solution including pure water, buffers and preservatives. The cleaning liquid composition can remove the polymer remaining on the conductive structure and the substrate without damaging the conductive structure, and can easily suppress metal contamination and particle contamination on the conductive structure. |