| abstract |
The semiconductor wafer plating method maintains a uniform thickness of the plated film, prevents precipitation on the backside of the wafer, and prevents contamination in subsequent processes. In directly forming a connection terminal on an aluminum electrode on a semiconductor wafer, electroless plating is performed with the back surface of the wafer covered with an insulator. It is preferable that an insulator is a glass substrate which is a component which comprises a product. Semiconductor-type sensors show improved corrosion resistance against corrosive media. The semiconductor sensor further includes a pad, which includes a structural portion for detecting a physical quantity or a chemical component of a corrosive medium, and an electrical conversion element on a semiconductor substrate, and an output terminal for transmitting the detected electrical signal to an external unit, wherein the pad is formed on a precious metal. Are protected byn n n n Semiconductor Devices, Electroless Nickel Plating, Electroless Gold Plating, Semiconductor Sensors |