| abstract |
The present invention relates to a light emitting device package, and forms a ring-shaped structure on two electrode metals spaced apart from each other, and a light emitting element and a zener diode on the two electrode metals exposed through the ring-shaped structure. By mounting a diode, the size and volume of the light emitting device package can be made smaller, which makes it very easy to miniaturize and slim electronic products and information communication devices, and bonds the light emitting device chip on the metal electrode metal having excellent heat transfer efficiency. Because of the structure, the heat generated when driving the light emitting device can be effectively released. |