http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100628445-B1

Outgoing Links

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2886
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-28
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filingDate 1999-09-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2006-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2006-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-100628445-B1
titleOfInvention Insulation plate for probe card and ring insert assembly containing same
abstract In the apparatus for testing a semiconductor wafer (FIG. 1), a ring insert assembly is attached between the wafer prober 14 and the test head 50. The ring insert assembly includes a ring insert 42 for supporting the probe card 62 and the insulation plate 54. The insulation plate (FIG. 3) generally comprises a rigid portion which is an annular plate made of a metal with good thermal conductivity. One surface 78 of the plate has a low emissivity and the opposite surface 76 has a low absorption. The surface of low water absorption is preferably a high gloss surface.n n n n DUT, semiconductor wafer, chuck, ring insert, insulation board, probe card, pogo pin
priorityDate 1998-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 21.