http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100607001-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/D10B2505-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-52 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/D06M15-21 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/D03D15-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/D03D13-004 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00 |
| filingDate | 2004-01-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2006-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2006-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100607001-B1 |
| titleOfInvention | Light emitting diode manufacturing method and encapsulation material |
| abstract | The present invention provides an encapsulation material for a light emitting diode (LED) comprising a photosensitive polymer composed of at least one oligomer or reactive monomer and a photoinitiator; And a photosensitive polymer comprising a photoinitiator and at least one of an oligomer or a reactive monomer, the method comprising: exposing the photosensitive polymer resin to visible light or ultraviolet light or an electron beam without infrared light after encapsulation of the LED chip. A method characterized by causing free radical polymerization of polymer resins and rapid curing at room temperature, promoting rapid curing and improving production efficiency while eliminating the need for heating in a furnace in a light emitting diode encapsulation process. It is about. |
| priorityDate | 2003-08-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 50.