http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100601479-B1

Outgoing Links

Predicate Object
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N2021-1742
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N21-8851
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K13-081
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N21-6452
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J43-04
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
filingDate 2004-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2006-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2006-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-100601479-B1
titleOfInvention Via hole inspection device and method of printed circuit board
abstract The present invention relates to a via hole inspection apparatus and method for a printed circuit board which can accurately determine whether a printed circuit board is defective by detecting an insulating resin residue remaining in a via hole of a printed circuit board using an optical method.n n n An apparatus for inspecting a via hole of a printed circuit board according to the present invention includes light emitting means for irradiating a light beam onto the via hole according to data about a coordinate of a via hole of a printed circuit board; Detecting means for detecting a light ray emitted from the via hole to determine whether an insulating resin remains; And control means for transmitting data on the coordinates of the via hole of the printed circuit board to the light emitting means, and determining whether the via hole is defective according to the data on the presence or absence of the insulating resin transmitted from the detection means. It is characterized by.n n n The via hole inspection method of a printed circuit board according to the present invention comprises the steps of: (A) aligning the position of the printed circuit board, and irradiating light rays on the via hole of the printed circuit board; (B) determining the presence or absence of insulating resin by detecting light rays emitted from the via hole; And (C) determining whether the printed circuit board is defective according to the presence or absence of the insulating resin.n n n n Printed Circuit Board, Via Hole, Inspection Device, AOI Device, Insulation Resin
priorityDate 2004-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559591
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID167583
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23931
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419556032

Total number of triples: 18.