http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100599406-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 2004-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2006-07-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2006-07-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100599406-B1 |
| titleOfInvention | Manufacturing Method of Multiple Solder Bump Using Solder Jetting Method |
| abstract | The present invention comprises the steps of: (a) melting a multi-element solder to be jetted and removing impurities of a predetermined size or more contained in the molten solder; (b) heating the multicomponent solder from which impurities are removed to melt the intermetallic compound included in the solder composition; (c) maintaining the solder at a temperature above the melting point, and jetting the solder to form solder bumps. |
| priorityDate | 2004-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 21.