http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100597466-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F21W2111-047 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F21L4-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F21S9-03 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/D06M11-42 |
| filingDate | 2004-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2006-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2006-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100597466-B1 |
| titleOfInvention | Substitution plating method of conductive fiber |
| abstract | The present invention is a substitution plating method of the conductive fiber used as a gasket, clothing, bedding, etc. to plate the silver or gold on the surface of the fiber to shield the electromagnetic waves by using the reducing power of silver or gold which is stronger than nickel Asn n n More specifically, when nickel is deposited on a metal surface by using a method such as electroless chemical copper plating, and then immersed in a solution containing silver or gold ions, the silver and gold ions are originally intended to exist as silver or gold itself. Since the reducing power is much stronger than nickel, silver or gold ions are forcibly deprived of electrons in the nickel, and nickel is oxidized and ionized, and silver or gold receives electrons from nickel and is reduced to be electrodeposited on the surface of the fiber. Silver or gold can be plated.n n n Conventionally, various types of plating methods using electrolytic or non-electroplating are known for producing conductive fibers for shielding electromagnetic waves generated from electronics, electrical circuit parts, and various devices. However, the plating of gold and silver is not evenly plated, which leads to a lot of loss of gold and silver and a decrease in commodity value, as well as a lot of difficulties in obtaining a uniform coating thickness. Was followed.n n n The present invention to solve the above problemsn n n The conductive plating allows the silver or gold plating with a uniform thickness on the surface of the fiber by the substitution plating method by oxidation and reduction of nickel and silver or gold, which greatly improves shielding efficiency, product value, and production cost. It is an object of the present invention to provide a substitution plating method of fibers.n n n Conductive Fiber, Substituted Plating |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102077426-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20200041799-A |
| priorityDate | 2004-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 61.