http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100597348-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1241 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1258 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67115 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-136286 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-12 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-336 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03C5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-786 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L41-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02F1-1343 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02F1-133 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02F1-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02F1-1362 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00 |
| filingDate | 2004-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2006-07-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2006-07-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100597348-B1 |
| titleOfInvention | Formation method of wiring pattern, manufacturing method of semiconductor device, electro-optical device and electronic device |
| abstract | Provided is a method in which the uneven shape is hardly formed on the surface of the substrate on which the wiring pattern is formed, and the wiring pattern having a very flat surface shape can be formed. The wiring pattern formation method of this invention is the 1st base material which the photothermal conversion layer containing the photothermal conversion material which converts light energy into thermal energy, and the sublimation layer containing a sublimable material are laminated | stacked in this order from the said base material side. With respect to (1), a bank is formed which sublimes a part of the sublimation layer by performing first light irradiation on the in-plane predetermined region from the sublimation layer side, and forms bank B made of the sublimation layer in a region other than this light irradiation region. And a conductive layer forming step of disposing a conductive layer 7 between the formed banks VII, and a conductive pattern layer 70 including the conductive layer 7 and the bank B and the substrate 2 to be processed. And a transfer step of transferring the conductive pattern layer 70 to the target substrate 2 by performing a second light irradiation on the opposed substrate.n n n n Wiring pattern, bank, base material, photothermal conversion layer, sublimation layer, conductive pattern layer |
| priorityDate | 2003-08-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 60.